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Patent US9242333 - Systems and methods for ingot grinding ...A method of grinding an ingot for use in manufacturing ... Try the new Google Patents, with machine-classified ... The silicon ingot is then machined into a desired ...
Grinding induced subsurface cracks in silicon wafersInternational Journal of Machine Tools Manufacture 39 (1999) 1103–1116 Grinding induced subsurface cracks in silicon wafers Z.J. Pei*, S.R. Billingsley, S. Miura
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